A company representative told Tom’s Hardware that the issue doesn’t require a redesign or re-spin of the Ryzen 9000 silicon and will not result in changes to the already-defined specifications for the various models. AMD will re-screen the chips pulled from the field to identify any with potential issues and then return unaffected models to retail channels. This indicates that not all chips suffer from the issue.
An AMD representative told us that the company “identified an issue with our package product testing process for Ryzen 9000 series processors that could result in a small number of products reaching the market that do not meet our quality standards.” AMD specifically cited the package testing process, implying that the issue resides in the packaging implementation (more on that below).
It says nothing is wrong with the silicon. I appears to be a problem in some units where the silicon die is mated with the materials that hold it (fiberglass PCB or its interconnects).