It requires 4X speed increase every year, production quality scale can’t provide even close to half of that, maybe 25%, then another 25% from design, and regarding increasing die sizes they are already close to the end. So the only way to get from 150% to 400% per year is by using multi chip designs, meaning they will have to use 2.5x more chips per year. so the multi chip package in 10 years will probably have to have almost 10,000 chips! All of them bleeding edge!!!
The H200 is estimated to cost $40K, the future 10 year chip will be more like $40 million. Or maybe more like impossible to achieve.