Thanks for posting! The authors conclude the US can still put a stop to this with coordinated effort. They recommend the US implement these steps to stop China from further developing domestic semiconductor technology, and I fully support that!
Here are some steps that could be taken to ensure that China does not develop the ability to mass-manufacture the sorts of chips needed for high-end military applications in the coming years:
Limit ArFi immersion lithography tools.
Limit servicing of existing equipment.
Limit ArFi photoresist.
Limit masks.
Limit mask blanks, writers, and other associated infrastructure.
Limit metrology equipment.
Limit CMP equipment.
Limit epitaxy equipment.
Limit dry etch equipment.
Limit CVD and ALD equipment.
Limit advanced packaging equipment.
Limit ion implantation equipment.
Limit semiconductor manufacturing equipment subsystems and subassemblies.
Limit etchant gas.
Limit deposition precursors.
Limit chips that have >25.6Tbps of IO even if they have no compute.